外露光刻胶的研制是光刻胶研制过程中最关键的步骤之一，因此对研制过程及其参数(温度、研制时间等)的选择要特别注意。在喷淋显影过程中，对每个基板分别进行单独显影，并在暴露区域连续喷淋新显影剂或蚀刻剂，以防止显影剂饱和。

SAWATEC开发人员可用于水坑或喷雾开发，在此过程中，根据应用程序的技术和经济标准选择最佳流程。与水坑开发相比，喷雾开发的优点是可以释放非常小的精细结构。水坑法的优点是，当衬底有较深的结构时，显着较少的显影液需要和较好的结果。

SMD系列用于清洗和显影8英寸(200mm)以下的晶圆或6英寸(150x150mm)以下的基板。过程——室工作Ø212毫米。

由SAWATEC公司开发的SMD具有良好的工艺性能、低的化学消耗和可靠的重复性，甚至具有较厚的光刻胶层。由于操作简便，易于清洗，这些仪器是理想的适合于实验室，研发，研究所和试点项目。

该仪器可作为台式或移动式机柜。

功能(基本配置)

FEATURES (BASIC CONFIGURATION)

§ Up to 50 programmes with 24 segments each can be programmed

§ Quick start function for repeat processes

§ User-friendly process configuration with touch screen panel

§ Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time

§ Electrical driven spray arm, with dynamic or static function

§ Developer line and media tank (2 litre) for one developer included

§ Nozzle for DI-water-rinse and N2 drying on the spray arm

§ Nozzles in the process bowl for the backside rinse

§ Control elements for dosing of the compressed air and vacuum

§ Rotational direction can be selected (CW, CCW)

§ Manual loading and unloading of the substrates

Mechanical substrate fixation

§ Acoustic signal when the process has finished

PERFORMANCE DATA

§ Speed range: 0 to 3’000rpm +/-1rpm 1)

§ Speed acceleration: 0 to 3’000rpm in 0.3 seconds 1)

§ Process time up to 2376 seconds

§ Developer spray time 99 seconds/segment

§ Speed of the spray arm 10 to 200mm/seconds

§ Rinse and N2 drying 99 seconds/segment

§ Heatable process hood up to 50°C

§ Spray nozzle made of PEEK 0,8mm

ADDITIonAL FUNCTIONS (OPTIONS)

§ Additional developer lines (up to 4 developer lines possible)

§ Start/stop foot switch for ease of operation (cable length 1.8m)

§ Separation unit for media exhaust (tank and laboratory equipment)

§ Developer tank heating system (2 litre)

§ Spray nozzle made of PEEK (0,3 / 0,5mm)

§ Nozzle for puddle developing