※ 100~ 300mm wafer Application. (One size application only) 

※ Basic wafer Thickness : 500~1,800um.

※ Cup Material: PVC /PP

※ Rotation Speed : Up to 800 rpm ± 1 rpm. 

※ 2-Chemical Spray Arm per cup.

※ Chemical Temperature RT-60℃

※ DI Spray Rinse.

※ N2 Spray Function (Anti-Static Function & Hot N2 ).

※ Flow rate & Pressure setting by recipe (DI / HOT DI / N2).

※ Process Chemical Drain.

※ Wafer On-site Sensor.

※ CCD Monitor System