Cup Function
※ 50~200mm wafer , 200~ 300mm wafer Applica
tion.
※ Basic wafer Thickness : 300~1,800um.
※ Cup Material: SUS 316L Coating PFA, PVC -Acid
model.
SUS 316L with EP - Solvent model.
※ Rotation Speed : Up to 3,000 rpm ± 1 rpm.
※ 2-Chemical Spray Arm per cup.
※ Chemical Temperature : 40~90 ℃/ 40~125℃
※ DI Spray Rinse.
※ N2 Spray Function (Anti-Static Function & Hot N2 ).
※ Back-Side Clean Function
※ Non-Vacuum Type Chuck.
※ Flow rate & Pressure setting by recipe (DI/ HOT DI/
N2).
※ Process Chemical Recycle or Drain direct by recipe
setting.
※ Wafer On-site Sensor.
※ CCD Monitor System
Other Function
※ 1~4-Type process Chemical for 2-cup Model.
※ Chemical Lifetime setting, circulation setting,
Auto Clean setting, Supply by facility / Local.
※ Dual-Arm Robot.
※ 50~200mm open cassette load port, Autodetect size .
※ Wafer Mapping function.
※ SMIF Moduleselection .
※ Auto-Load port .
※ Dual-Size application, not change any parts.
※ FIRE SYSTEM (option)
※ SECII/GEM CIM optional.
※ CSU (Chemical Sipply/Mix unit) connection.