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德国SUSS SB6/8 Gen2 晶圆键合机：
SB6/8 Gen2 SUSS MicroTec为多种焊接工艺提供了一个半自动平台。处理高达200mm的晶圆以及各种形状和类型的基板，SB6/8 Gen2为各种应用和工艺环境提供了灵活的工具。SB6/8 Gen2适用于满足MEMS、LED、高级封装、2、5D集成和3D集成要求的封装及结构。
SB6/8第二代允许从研发到试生产和最终批量生产的轻松转换。
With the SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration.
The SB6/8 Gen2 permits an easy switch from R&D to pilot production and finally volume manufacturing.
