切割砂轮切断开槽划片_刀具_切割设备耗材_半导体加工设备耗材_耗材馆

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整体型切割砂轮是由金刚石或立方氮化硼（CBN），通过树脂结合剂结合，在特殊工艺条件下制作而成。树脂整体型切割砂轮主要用于半导体封装材料、光学玻璃、石英玻璃、陶瓷材料等精密元器件的精密切割与开槽。
Product overview Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass, ceramics and son on.

整体型切割砂轮内外采用同一种材料制作，厚度较薄，精度高，多用于高精度、小切深的切槽和切断。型号分为 1A8/1 和 1A8/2 型。

组刀切割，大幅度提高切割效率砂轮外圆消耗及工件切割品质一致性佳配方丰富，可满足对不同材料的切割需求先进的机加工与装配调试工艺保证组刀尺寸、形位高精度

主要应用于光学玻璃、石英、玻璃管、陶瓷、宝石、陶瓷套管、磁性材料、工具钢、轴承钢、硬质合金、电子元件等的高效切断或切槽。

主要特点：

主要应用领域

Main features Gang saw cutting could improve efficiency The consumption of cylindrical and the cutting quality is good Various formulas can meet different cutting requirements for various materials. Advanced machining and processing ensure the size and shape and position accuracy

Application Mainly used for cutting off and slotting optical glass, quartz, glass tube, ceramic, gems, ceramic pipes, magnetic materials, tool steel, bearing steel, carbide, electronic component and so on.

Specification Z1A8、Z1A1、Z1A1R

轮毂型电镀超薄切割砂轮用于半导体集成电路及分立器件制造过程中的开槽、切割、划片，主要切割材料有硅片、砷化镓、玻璃、陶瓷、石英、半导体复合材料等。该产品精度高、寿命长，性能达到国外同类产品水平。

Electroplated bond blades with hub are used to groove, cut, and dice silicon, GaAs, glass, ceramic, quartz and compound semiconductor material wafer in integrated chips and discrete devices production. This product has high precision and long life span. Its performance has achieved abroad advanced level.