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    6000 FSA光刻机

    应用于半导体行业:

    半导体加工设备-光刻设备-UV光刻机

    产品品牌

    OAI

    库       存:

    10000

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    全国

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    邮件:lxyele@126.com

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    主营:UV灯零售、等离子清洗机、等离子刻蚀机、UV光清洗机、准分子清洗...

    地区:中国-广东省

    地址:深圳市宝安区沙井街道共和第四工业区A6栋761

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    品牌:OAI

    型号:

    所属系列:半导体加工设备-光刻设备-UV光刻机

    型号6000 FSA用于生产的全自动,上侧或后侧光刻机

     

    用于:半导体,MEMS,传感器,微流体,IOT,包装

    凭借在半导体行业40多年的制造,OAI满足了一个新的精英阶段的生产光刻设备的动态市场的日益增长的挑战。

    建立在着名的OAI模块化平台上,6000系列具有完全自动化的亚微米分辨率的顶侧或背侧对齐,提供无与伦比的性价比。

    对准器具有先进的光束光学,在第一掩模模式下具有优于±3%的均匀性和每小时180个晶片的吞吐量,这导致更高的产量。 6000系列可以处理厚和粘合基板(高达7000微米),翘曲晶片(高达7 mm-10mm),薄基板(低至100微米厚)和厚光致抗蚀剂的各种晶片。

    具有卓越的工艺重复性,6000系列是所有生产环境的完美解决方案。选择顶部或可选的背面对齐,使用OAI的基于Cognex的自定义模式识别软件。对于总体光刻工艺,Series1 6000可以与集束工具无缝集成。 OAI的新生产面罩对齐器是总包。

    好处

    ·全自动

    ·侧面对齐

    •可选:底部对齐

    UV到NUV

    ·集群工具集成

    ·自定义软件

    规格

     

    曝光系统

    曝光模式真空接触硬接触软接触接近(2μ间隙)

    高级光束

    均匀梁尺寸:50mm - 200mm方形/圆

    200mm-300mm见方/圆

    均匀度:优于±3%

    相机:双摄像头与CCTV扩展的景深

    对齐系统

    模式识别CognexvisionPro¹™与OAI定制软件

    对准精度0.5μ顶面

    1.0μ,顶部到底部可选背面对齐

    预对准精度优于±50μ

    自动对齐顶部到底部

    顶部

    晶片处理

    基材尺寸50mm-200mm圆形或方形或200mm-300mm圆形或正方形

    薄晶片低至100M

    翘曲晶片高达7mm-10mm

    厚和粘合基板高达7000μ

    机器人单臂和双臂晶片处理

    失步补偿标准软件或可选的热卡盘

    晶片尺寸转换5分钟以内

    吞吐量第一掩模每小时180个晶片 - 随后75-100个晶片每小时

    楔形效果平整3点或可选非接触

    可用选项

    IR自动对齐,

    盒式磁带映射

    365nm LED曝光光源

    温度控制晶片卡盘

    集成屏蔽管理控制

    用于全光刻的集成光刻集群

    使用SMIF或FOUP接口模块的过程环境控制

    非接触式调平

    边缘夹紧

     Model 6000 FSA Fully Automated, Topside or Backside Mask Aligner for Production

    光刻机Model6000FSA Mask Aligner

    For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging

    With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

    Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

    The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

    With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

    BENEFITS

    · Fully Automated

    · Topside Alignment

    · Optional: Bottomside Alignment

    · DUV to NUV

    · Cluster Tool Integration

    · Customized Software

    SPECIFICATIONS

     

     

    Exposure System

    Exposure Modes

    Vacuum contact

    Hard contact

    Soft contact

    Proximity (2μ gap)

     

    Advanced Beam Optics

    Uniform Beam Size:

    50mm - 200mm square/round

     

    200mm - 300 mm square/round

    Uniformity:

    Better than ±3%

    Camera:

    Dual Camera with CCTV with Expanded Depth of Field

    Alignment System

    Pattern Recognition

    Cognex visionPro¹™ with OAI customized software

    Alignment Accuracy

    0.5μ topside

     

    1.0μ with top to bottom optional backside alignment

    Pre-alignment Accuracy

    Better than ±50μ

    Auto-alignment

    Top to bottomside

     

    Topside

    Wafer Handling

    Substrate size

    50mm – 200mm round or square or 200mm-300mm round or square

     

    Thin wafers

    Down to 100Μ

     

    Warped Wafers

    Up to 7mm-10mm

     

    Thick & Bonded Substrates

    Up to 7000μ

     

    Robotics

    Single and dual arm wafer handling

     

    Run-out compensation

    Standard software or optional thermal chuck

     

    Wafer size conversion

    5 minutes or less

     

    Throughput

    1st mask 180 wafers per hour - subsequent 75-100 wafers per hour

     

    Wedge Effect Leveling

    3 point or optional non-contact

     

    Available Options

     

    IR Auto-align,

     

     

    Cassette Mapping

     

     

    365nm LED Exposure Light Source

     

     

    Temperature Controlled Wafer Chuck

     

     

    Integrated Mask Management Control

     

     

    Integrated Lithography Cluster for Full Lithography

     

     

    Process Environment Control with SMIF or FOUP Interface Modules

     

     

    Non-contact Leveling

     

     

    Edge Gripping

     

    咨询

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