网站首页

|EN

首页 » 技术服务馆 » 工艺方案设计 » 封装 » 正文

QFN四方扁平无引线封装

发表于:2017-12-27  作者:mql12532  关注度:309

 

Anst's QFN (Quad Flat No-lead Package) is a family of JEDEC compliant QFN and DFN plastic packages. This near CSP package family is available in sawn type & two kinds of package thickness, value=".9" unitname="mm">0.9mm & value=".75" unitname="mm">0.75mm typically. The package size offered range from value="2" unitname="mm">2mm x value="2" unitname="mm">2mm to value="10" unitname="mm">10mm x value="10" unitname="mm">10mm.

Some of these packages are also available in flip chip configurations.

Availability

 

 

QFN

Quad Flat No-lead Package

 

 

Package Type

Lead Count

QFN2*3

8

QFN2.5*5.5

24

QFN3*3

10,16,20

QFN3*4

12, 24

QFN4*2.5

12

QFN4*4

16,20, 24

QFN4.4*4.5

24

QFN4*6

38

QFN5*5

16,28,32,40

QFN5*6

8

QFN6*6

12,36,40,48

FCQFN2*2

12,14

FCQFN2*3

10,12,13,14

FCQFN3*3

8,14,16

FCQFN3*4

13,14,20,21

FCQFN4*4

23

FCQFN4*5

25

FCQFN5*5

26,30

FCQFN5*6

36

FCQFN6*6

34


商家资料

提示:注册 查看!

服务热线

4001027270

功能和特性

价格和优惠

微信公众号