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封装测试, 晶圆切割,贴片, 快速打样

发表于:2025-08-07  作者:davosemi  关注度:152

 致达沃克斯的合作伙伴:

 

我们是一家专业做IC快速封装(灌封,陶瓷、塑脂)服务的公司,可以做wafer、MPW的减薄、切割、快封、测试等服 务,根据具体实际技术方案,有些报价要case by case,假如您希望得到我们较详细的评估结果,请联系:

张   13981718459sales@davosemi.com

 

范经理 18980788560tomfan@davosemi.com

 

我们会及时处理您的咨询,希望可以帮到您,同时也欢迎来参观考察我们实验室产线,期待与您面谈;

To Davosemi Partners:

 

 We are a professional company specializing in IC rapid packaging and R&D development (encapsulation, ceramic, plastic,over-molding ) services. We can provide wafer and MPW thinning wafer backgrinding, wafer dicing,steath dicing, SMT, fast packaging, testing and other services. According to the specific technical plan, some quotations will be case by case. If you want to get our detailed evaluation results,

please contact:

Zhang Jing 13981718459,sales@davosemi.com;

Tom Fan 18980788560,tomfan@davosemi.com;

 We will deal with your consultation in a timely manner, hope to help you, also welcome to visit our laboratory production line, looking forward to meeting with you;

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