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Highlights
Contact-free imaging
High resolution imaging (25 to 1,000,000 points)
Defect imaging
Mapping of encapsulated layers
Contact-free imaging
High resolution imaging (25 to 1,000,000 points)
Defect imaging
Mapping of encapsulated layers
Parameters
Sheet resistance (Ohm/sq)
metal layer thickness (nm, µm)
metal substrate thickness (µm)
Anisotropy
Defects
Integrity assessment
Sheet resistance (Ohm/sq)
metal layer thickness (nm, µm)
metal substrate thickness (µm)
Anisotropy
Defects
Integrity assessment
Applications
Touch screens and flat monitors
OLED and LED applications
Smart-glass applications
Transparent antistatic foils
Photovoltaics
Semiconductors
De-icing and heating applications
Batteries and fuel cells
Packaging materials
Touch screens and flat monitors
OLED and LED applications
Smart-glass applications
Transparent antistatic foils
Photovoltaics
Semiconductors
De-icing and heating applications
Batteries and fuel cells
Packaging materials
Materials
metal films and meshes
Nanowire films
Graphene, CNT, Graphite
Printed films
Conductive polymers (PEDOT:PSS)
Other conductive films and materials
